The iPad 3G was released in the US yesterday. Of course, the team at iFixit has already posted their teardown. We wouldn’t expect anything less, right? So just what did this teardown reveal inside the iPad 3G model?
Some notes from the iFixit team:
Apple soldered the EMI shield onto the communications board, making it challenging for us to show you the chips. Despite this adversity, we pressed forward undaunted, fearlessly unsoldering the board to reveal to you:
● Infineon 337S3754 PMB 8878 X-Gold baseband IC 5Y06115. This part had the Infineon logo in the pre-production unit, but Apple has white-labeled it to obscure the manufacturer. This is the exact same baseband processor as the iPhone 3GS.
● Skyworks SKY77340 Power Amplifier Module
● Three Triquint power amplifier / filters.
● Infineon U6952
● Numonyx 36MY1EE
● Along the right are three TriQuint power amplifiers: TQM616035A, TQM666032B, and TQM676031A. These are the same three chips that Apple used in the iPhone 3G nearly 2 years ago.
● Broadcom A-GPS BCM47501UBG F01003 P11 949871 SN
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Posted under: iPad News